New Equipment | Soldering - Other
ASSCON Vapor Phase Soldering: ASSCON VP2100 Vacuum, ASSCON VP800 Vacuum, ASSCON VP6000 Vacuum & ASSCON VP7000 Vacuum
Technical Library | 2019-05-23 10:38:07.0
Solvent and co-solvent cleaning involves the use of engineered solvents in a vapor phase system. The solvents classically used were Class 1 Ozone Depleting Substances, but new types of solvents have been developed that are less environmentally harmful. In some cases, isopropyl alcohol is used with a co-solvent. In these types of cleaning systems, a cloud of boiling vapor solvent is maintained between a boil sump and a cooling coil. When the items to be cleaned are immersed in the vapor cloud, the solvent condenses on the assemblies and acts to dissolve the residues. These processes usually involve a final rinse step outside of the vapor cloud to ensure that all dissolved residues are washed off the assemblies (Figure 1).
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Used SMT Equipment | Pick and Place/Feeders
YAMAHA placement machine-YV180Xg equipment parameters: Theoretical mounting speed: 0.095 seconds/CHIP, actual 20000CHIP/H. Production PCB size: L330 x W330 ∼ L50 x W50mm / t = 0.4 ∼ 3.0mm. SMD components range: 0402∼SOP, SOJ, 84 Pin
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
PCB Reflow Oven Machine I.C.T Lyra Series I.C.T Lyra Series Reflow Oven is made with Nitrogen Standard. Customer can add nitrogen at any time in future I.C.T brings 26 years of experience in the SMT industry. On-site installation and training Availa
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Industry News | 2013-08-07 09:58:46.0
The SMTA launched an online re-certification program for engineers whose 10-year SMT Processes Certification is expiring.
Industry News | 2014-10-16 19:22:45.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, IL.
