Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.
Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i
Electronics Forum | Wed Dec 08 17:58:44 EST 1999 | Dave F
Dave: You should see a solder smudge on the gold plating where the ball was attached, if there is (was) solder reflow during either the (1) BGA fabrication, (2) your BGA attach, and / or (3) your BGA removal. You rework will not remove the solder
Electronics Forum | Thu Jun 24 11:29:50 EDT 1999 | Matt Stump
| Hi | Could anyone tell me where i can find information, in the literature or on the Web, concerning measurements of temperature distribution, expansion, stresses in the substrate and heat sink and on the interface between them, that is all the rang
Electronics Forum | Tue Jun 08 12:01:46 EDT 1999 | Steve Skinner
I am trying to find out as much information as possible relating to conductive inks. If anyone out there is using them please give some advice. 1) How are you curing the ink? 2) What type of substrates are you using and who supplies them? 3
Electronics Forum | Thu Mar 18 10:09:57 EST 1999 | Stefan Witte
| My engineering Dept. has informed me that they want | to start using pins, on an aluminum substrate in the | smt process. Pins are interconnect for daughter bds. | Dia. of pins 0.020" 0.040" 0.080" flat bottoms | 1) Does any one know how to
Electronics Forum | Mon Dec 28 12:16:40 EST 1998 | Jon Medernach
Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mechan
Electronics Forum | Tue Dec 29 10:24:35 EST 1998 | Earl Moon
| Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mech
Electronics Forum | Wed Nov 11 23:45:53 EST 1998 | Mark D.
What are the factors that go into determining PCB Board temperature requirements for the Wavesolder process? Most of the recipes I've seen call for preheating the PCB to around 230F - 250F. This temp is about 210F - 230F below the typical solder temp
Electronics Forum | Fri Nov 13 14:39:04 EST 1998 | J.A.B.
Also the preheating of the board is done to help evaporate any water/alcohol that is in the flux - water is a big problem in No-clean processes. From our experience, a temp range around 200f - no more than 220f is ideal for the bigger boards, but tem
Electronics Forum | Mon Feb 23 15:10:02 EST 1998 | justin medernach
| Stencil Opening | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable Ron, Use a six mil foil thickness for your stencil. Go one to one with your apert
