Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon
| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Fri Nov 03 17:36:37 EST 2000 | Thomas Ballhausen
Thank you for your hint. According to the substrate supplier the thickness is less than 1 micron. After Ni/Co layer there is water rinse, then "gold strike", another rinse then "gold plating". But still the total Au layer shall be less than 1 micron
Electronics Forum | Wed Oct 25 10:33:08 EDT 2000 | Chris
I need to know the advantages or disavantages of a plastic or FR4/Flex based BGA over the ceramic based BGA. We have a BGA package we are going to have produced. Some want to have it made out of ceramic because they feel a ceramic package will be a
Electronics Forum | Mon Aug 21 20:20:18 EDT 2000 | Dave F
Hi CJ: I guarantee you that the portions of you BGA that will physically move the most as a result of changing temperature are the corners. For this very reason, many BGA have BT substrates that have a tg of 210�C. I would demonstrate the potentia
Electronics Forum | Thu Aug 17 05:56:39 EDT 2000 | Jacqueline
Hi Folks, Hope yous can help. I'm having a problem when reworking (placing) 40mil BGAs. One side seems to be collapsing more so that the other, resulting in the outer row of balls not properly reflowing and making the connection. This is only happeni
Electronics Forum | Tue Apr 24 10:05:09 EDT 2001 | Robert Steltman
Help please.... We have just run a prototype board using a number of BGA devices on it. The corners on two of the BGA's (PBGA357) seem to be higher than the centre of the device. ie the outer bumps seem to be "stretched" compared to the centre bumps
Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark
BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think
Electronics Forum | Tue Jun 26 20:40:36 EDT 2001 | davef
Your profile seems reasonable, as you say. As CPI says: Sure it could be planiarity issues with the balls, but that is not something that makes me want to do a Pete Rose belly-flop, head-first slide into first base that this is the source of your p
Electronics Forum | Wed Aug 15 18:16:15 EDT 2001 | Shindler
Hi Larry- Be wary of which IR systems you use, dark IR (ERSA) maintains only the positive effects of infrared use in that this infrared medium wavelength has the optimal absorbtion/reflection ratio between light and dark colors. Therby, guaranteeing
