SMT On-line 3D Solder Paste Inspection If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in
New Equipment | Rework & Repair Services
BEST Inc and its subject matter experts to help you diagnos, troubleshoot and develop your PCB rework processes. Our PCB consulting services have assisted OEMs, contract manufacturers and repair centers develop repeatable processes for the rework and
ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide. Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref
New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
New Equipment | Solder Materials
NP505-LT is a no-clean, Pb-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components. Warping is becoming more evident with the trend towards complex boards and the trend of using thinner and larger pack
New Equipment | Test Equipment
The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolution o
New Equipment | Test Equipment
The AKM600P is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for wafers or panels up to 600 mm x 600 mm. With time-temperature profiling capa
See what you've never been able to see before, with one of Malcom's Reflow Simulators. Each of our units can recreate your reflow temperature curves. And with the viewing windows, you now have the ability to monitor what is happening to your PCB duri
SEM Lab, Inc. provides a comprehensive approach to BGA assembly validation using microsection and SEM analysis. The results can be used to optimize assembly processes early in the product development cycle and help to prevent failure durin
Saki's BF-3Si is one of the world's fastest 2-projector solder paste inspection systems while Saki's Phase Measurement Profilometry with Liquid Crystal on Silicon (LCoS) technology ensures high repeatability of inspection results. Height inspectio
