Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
V3/V4/V5 vapor phase reflow oven Model: V3/V4/V5 Product Description Product introduction: The name V3/V4/V5 is called according Vacuum , means professional industrial Vacuum reflow oven . Why chose Vacuum reflow oven? Recently ,the main weld
Industry News | 2019-12-16 22:47:11.0
The difference between gas phase reflow welding and hot air reflow welding is that gas phase reflow welding USES vapor phase liquid to heat the key.
Industry Directory | Manufacturer
Manufacturer of vapor phase soldering systems and associated products since 1985.
Industry Directory | Manufacturer
R&D Technical Services was formed in 1996 to support the Vapor Reflow market and is currently the leading source of Vapor Phase equipment.
Technical Library | 2012-09-13 20:45:17.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).
The main model of the CIF by Exmore range is the vapor phase VS-500.IV. The concept of the machine allows to solder even the most complex cards of a format of 500 x 500 x 60 mm while ensuring optimal quality thanks to, • The inert atmosphere re
The “PTP® VP-8” is a complete thermal profiling solution for the vapor phase solder process, using the award winning, M.O.L.E.® MAP software, in combination with the German-Engineered PTP® Vapor Phase profiler. This match-up provides all the power &
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
