Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
New Equipment | Assembly Services
Rapid Coatings offers both manual and automated coponent underfill services using a variety of encapsulants to help protect customer's sensitive compnents on their assemblies.
New Equipment | Assembly Services
Rapid Coatings offers both manual and automated coponent underfill services using a variety of encapsulants to help protect customer's sensitive compnents on their assemblies.
Yincae’s SMT 158 Capillary Underfill is a combination of capillary flow and no-flow underfills, rapid curing, fast flowing and easy reworking liquid epoxy that can be used as an underfill for chip scale packages, ball grid array devices, PoP (package
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
(Albany, NY) 1/2/2018 – YINCAE Advanced Materials has recently developed a reflowable (no flow) underfill: SMT 160. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering and underfilling in SMT p
(Albany, NY) 1/3/2018 – YINCAE Advanced Materials has recently developed a low temperature curable reflowable (no flow) underfill: SMT 160L. This product is designed to eliminate capillary underfills, simplify the assembly process, combine soldering
World's First Super Fast Low Temperature Underfill. SMT88U is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature without preheating a
5 W/mK) No Resin Bleed
