Electronics Forum | Fri Jul 30 04:41:01 EDT 1999 | Bernard Mulcahy
I have been asked to supply a maximum shelf life for our assemblied PCB's. I realise this is dependent on so many factors- temperature, humidity, no of layers etc. But does anyone have a formulae for calculating shelf life, or does anyone know of a s
Electronics Forum | Sun Dec 31 07:31:40 EST 2006 | davef
Thoughts are: * Eliminate solder spotting on gold fingers through process improvement in broard handling, printing paste control, and reflow recipe development. Search the fine SMTnet Archives for previous discussions. * Dispense or print a reflow te
Electronics Forum | Mon Jan 25 13:56:45 EST 1999 | Parvez Patel
Chang Hong while developing our CSP rework process, we found a temperature spread of about 130C at a distance of approx 150 mils from the component edge. our nozzle had about 20 mils clearance from all sides of the component being reworked. depending
Electronics Forum | Mon Aug 21 09:11:30 EDT 2000 | Eric Soderberg
Currently use Hysol TS300 latex mask and need to explore alternative methods of drying the mask. The mask is applied with a Asymtek Century Dispenser and placed on drying shelves. Air dry is dependent on temperature/humidity. Tried all the UV masks o
Electronics Forum | Tue Feb 20 16:33:08 EST 2001 | davef
Time, time, time. There just never seems to be enough!!! Eh? You�re correct. Depending on the material, some trays can take a high temperature bake, while other trays, in addition to tubes, and reels, require a low temperature bake. With this la
Electronics Forum | Wed Jun 29 03:37:53 EDT 2005 | lupo
Hi, I think that the time depends on the type of stainless steel, temperature and solder alloy. For example, one of our machines is delivered with 316 stainless pot and alloy SnNi. It worked six months (120days*16hours = 1920hours) and aft
Electronics Forum | Fri May 31 12:28:45 EDT 2019 | slthomas
You really need to define what you mean when you say "bend" and when you say "break". You might have zero damage to a bare board but cracked solder joints and ceramic caps on an assembly, given the same amount of bending or stress. It all depends on
Electronics Forum | Sun Mar 21 21:27:26 EST 2004 | laxman
We are also facing this issue. Normally we are baking all MSD 24 HRS @125�C. This may not be a standard practice. I have read that depending on the Package thickness Baking time and temperature varies apart from the storage conditions of the IC. IS t
Electronics Forum | Fri Jan 24 11:05:38 EST 2003 | johnw
I fyour just using Sn/Pb in your paste even using nitrogen will lave you with slightly grainy joints. The silver from your PCB will disolve into the Sn/Pb at 'uncontrolled' rate what I mean is depending on the temperature and time above liquidous the
Electronics Forum | Wed May 05 13:15:43 EDT 1999 | Boca
| Can anyone pls email me a typical temperature profile for wave soldering process. | | Thank you vey much. | | rdgs... | Typical depends on the processes you're developing. Key factors in my experience are flux type and requirements, component
