SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications If you don't see images, please visit online version at: http://www.smtnet.com/express/ News Forums SMT Equipment Company
A High Performance and Cost Effective Molded Array Package Substrate A High Performance and Cost Effective Molded Array Package Substrate In this article we present both a relatively new and innovative family of packages that is suitable
Manufacturing Substrates with Embedded Passives Manufacturing Substrates with Embedded Passives Passives account for a very large part of today's electronic assemblies. This is particularly true for digital products such as cellular phones
