Electronics Forum | Tue Dec 14 11:13:43 EST 1999 | Chris May
Paul, I have (as many have) come across this problem due to misregistration of resist at the PCB fab. You didn't say if these boards are inexpensive double sided or costly multis. I know this shouldn't make a difference on quality but I would tend t
Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette
In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b
Electronics Forum | Fri Sep 29 13:51:46 EDT 2000 | C. Ortner
We work in a "low" volume high reliability house building mixed tech double sided multi layer CCA's for long lived space applications. Our present problem is inspection questioning every dimple/anomaly on every leadless part(we put passives only thr
Electronics Forum | Wed Jun 14 08:08:56 EDT 2000 | Wolfgang Busko
Hi ji tae, we had a similar problem with QFPs 0,5 pitch processed by one subcontractor. The symptoms we noticed were: - the solderjointshape and wetting looked normal - the surface had a dull gray appearance - by pushing a lead sideways with a tweez
Electronics Forum | Wed Jul 03 03:02:35 EDT 2013 | autoel
How to test the reflow solder joint shear strength? What are the specification to test solder joint shear strength? What are the different methods to test the solder joint shear strength? Vijayashree
Electronics Forum | Tue May 27 11:59:14 EDT 2003 | blnorman
Is anyone aware of any reports, studies, articles on the subject of silicon contamination in SnPb solder joints. We are evaluating repair of conformally coated (silicone) boards. The fear is that we will never totally remove the silicone and once i
Electronics Forum | Tue Jan 29 13:06:40 EST 2002 | Sergio Vito - Alan Patrick - Cristiano Dick
Dear sirs, We are experiencing problems with lines of lead formed inside the solder joint. In others words, there is a problem with the formation of the solder joint, after analyses on a microscope we can see the lead grouped in some positions. This
Electronics Forum | Tue Dec 23 01:23:45 EST 1997 | J.H Kim
I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly.
Electronics Forum | Thu Oct 25 08:19:53 EDT 2001 | Dave G
Sounds like somthing disturbed the solder joint while it was @ liquidus. Could the part/leads be moving on the 2cnd pass ?
Electronics Forum | Wed Jan 28 14:35:12 EST 2004 | swagner
Has anyone in the industry had even a fair amount of success inspecting reflowed solder joints to IPC class 3 standards? I am not interested in hearing from system reps or people who work for an AOI manufacturer. Thanks,
