Industry News: signal integrity (Page 3 of 52)

Best Technical Paper at IPC APEX EXPO 2021 Selected

Industry News | 2021-02-25 13:34:06.0

The best technical conference paper of IPC APEX EXPO 2021 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will be recognized during show opening remarks on Tuesday, March 9.

Association Connecting Electronics Industries (IPC)

International Conference on Soldering and Reliability Call for Abstracts

Industry News | 2017-01-17 15:17:33.0

The SMTA is pleased to announce the Call for Abstracts for the International Conference on Soldering and Reliability June 6-8, 2017 in Markham, Ontario, Canada. The deadline to submit an abstract is February 28, 2017.

Surface Mount Technology Association (SMTA)

Mike Bixenman, KYZEN Corporation, Wins Best of Presentation Award at the 2017 International Conference on Soldering and Reliability (ICSR)

Industry News | 2017-08-01 06:08:55.0

The SMTA is pleased to announce that Mike Bixenman, DBA, KYZEN Corporation was selected to win the “Best of Presentation” Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his presentation “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.” The award is determined through the evaluations of those that attended the presentation.

Surface Mount Technology Association (SMTA)

Electrochemical Reliability Is the Focus of Session 4 at SMTA Europe's Harsh Environments

Industry News | 2018-04-15 20:01:15.0

SMTA Europe announces Session 4 Technical Program on Electrochemical Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

Electronics in Harsh Environments Conference Announced

Industry News | 2017-08-26 20:18:39.0

SMTA and SMART Group are excited to announce plans to co-organize the Electronics in Harsh Environments Conference. The event will be held April 24-26, 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments.

Surface Mount Technology Association (SMTA)

Design Innovations and Best Practices Featured at IPC APEX EXPO 2011

Industry News | 2011-01-27 15:53:22.0

Providing the latest information on design innovations and best practices, the IPC Designers Forum and several design-focused educational programs and activities will be held at IPC APEX EXPO 2011, April 10–14, 2011, in Las Vegas.

Association Connecting Electronics Industries (IPC)

Design Innovations and Best Practices at IPC APEX EXPO 2012

Industry News | 2011-12-07 20:56:54.0

Innovations and best practices will be featured in the IPC Designers Forum and design-focused courses at IPC APEX EXPO 2012, February 26-March 1, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

Industry News | 2019-03-10 20:30:11.0

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:

Association Connecting Electronics Industries (IPC)

IPC Design Competition Champion Crowned at IPC APEX EXPO 2024

Industry News | 2024-04-29 08:34:13.0

At IPC APEX EXPO 2024 in Anaheim, Calif., five competitors squared off to determine who was the best of the best at PCB design.

Association Connecting Electronics Industries (IPC)

IPC’s NCEDAR CONFERENCE AIMS TO BOOST INDIA’S ELECTRONICS INDUSTRY

Industry News | 2012-11-27 15:24:14.0

IPC’s National Conference on Electronics Design, Assembly and Reliability (NCEDAR), to be held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India, will provide information on state-of-the-art technologies in printed circuit board design and manufacturing.

Association Connecting Electronics Industries (IPC)


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