Electronics Forum | Tue Oct 06 16:50:51 EDT 1998 | Manish
Hello Everybody Would anyone of you know about the impurities in the Ni/Au pad metallurgy (board side metallurgy) affecting the assembly of the chip on the board. I was told that impurities in gold may lead to void formation in the solder bumps.
Electronics Forum | Mon Apr 29 03:16:43 EDT 2002 | Bob Willis
I have only seem problems so I would suggest you don't do it.
Electronics Forum | Fri Jun 07 12:36:08 EDT 2002 | jseagle
What is the recommended board finish for 0402s? Is HASL good enough or is Ni/Au better? Thanks
Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao
I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame
Electronics Forum | Mon Apr 05 12:30:47 EDT 2004 | russ
Nothing has changed recently with the above mentioned finishes. so the archives will bring you up to date. Russ
Electronics Forum | Wed Apr 05 20:52:51 EDT 2006 | davef
If you let the silver content of your solder connections get much above 3 percent, it could cause reliabilitility problems, similar to the problems caused when the gold content gets too high.
Electronics Forum | Thu Apr 13 07:18:47 EDT 2006 | Charles
It will be hard to solder metal that finish by any coating. So you should remove the coating first. You need strong acid to remove coating. After you solder both then you can silder finish esay.
Electronics Forum | Fri Feb 23 07:34:52 EST 2007 | mika
Many thanks, DaveF I learn something new every day. Sincerely,
Electronics Forum | Mon Mar 05 22:42:30 EST 2007 | davef
On your ENIG thickness requirements, search the fine SMTnet Archives for previous discussions, like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=33661 On determining if your board will solder properly: ANSI/J-STD-003, Solderability Te
Electronics Forum | Tue Mar 06 09:42:15 EST 2007 | realchunks
Hi Mark, Solder paste will not flow on Ni like it appears on HASL. Where you print it is where it will reflow. Has been like that for years. As a CM you should re-engineer / recut your stencil to provide proper solder joints. I seriously doubt i
