Electronics Forum: multilayer (Page 3 of 23)

Which is best Selective Soldering or Robtoic soldering

Electronics Forum | Thu Oct 04 09:44:24 EDT 2007 | hussman

It realy depends on your product. Tighter tollerance boards require a better machine, which costs more money. Multi-layered baords wih a alot of heat sink will require preheat - something a lot of selective solder machine do not come standard with.

Board Warpage

Electronics Forum | Sat Apr 26 08:18:47 EDT 2008 | davef

Your warpage problem could be caused by change in: * Multilayer board construction (not homogeneous or unbalanced - too resin rich or poor) * Supplier process capabilities (lamination cycles) * Material selections (usually cheap and dirty), etc.

Multilayer PCB X-ray inspection

Electronics Forum | Thu Apr 01 15:19:54 EDT 2010 | dilogic

We've got prototype 6-layer PCB's and I suspect that mfg. swapped some internal layers. Would it be possible to use some form of x-ray inspection to verify that? Any ideas?

Repair Units

Electronics Forum | Fri Feb 24 02:33:29 EST 2012 | soppcb

Hi, guys, this is jack from soppcb technolgy in shenzhen, we are a professioanl manufacturer of PCB and PCBA, including single sided pcb, double boards, multilayer boards, HDI, aluminum led boards and so on, if any needs, pls contact me here or my ad

Improving PTH fill using select solder

Electronics Forum | Wed Dec 19 09:41:14 EST 2012 | dyoungquist

What is your solder pot temperature? We found that on a 0.093" multilayer board increasing the temp of the lead free solder from 300C to 315C helped with the barrel fill.

PCB Delamination

Electronics Forum | Tue Jun 05 06:37:48 EDT 2012 | mosborne1

Definition: Pink Ring - A condition that can exist in multilayer printed circuit or wiring boards, in which the oxide around a through-hole inner layer interface is chemically removed, and there is a lack of adhesion of the inner layer to the dielec

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Mon Jul 30 20:38:02 EDT 2012 | davef

I'm with you on microcracking. The best way to confirm this is through sectioning of the affected capacitors. You're fortunate to be seeing these failures showing-up early in your product life. Of times these failures don't appear for years.

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 12:44:26 EDT 2012 | rway

I would look at your de-paneling process. How are you cutting the boards? This could be inducing mechanical stress on the component; especially if the part is close to the edge of the pcb and perpendicular to it.

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 13:16:23 EDT 2012 | rway

Most likely the depaneling is not your issue, but I do concur that there is some mechanical stress occurring somewhere. What about any fixturing for FT/ICT?

Hi anyone have recommended pcb manufacturer?

Electronics Forum | Wed Aug 02 23:28:44 EDT 2017 | dawson

there are many ideal pcb manufacturers can reach your requirements. multi-layer and hdi boards, you can try and test http://www.madpcb.com


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