Electronics Forum | Fri Dec 03 18:01:39 EST 1999 | Dave F
Chris, Two points of perspective are: 1 Solderability: The shelf life of components has elapsed when they are no longer solderable. There's tons of variables that affect this, but keys are: * Intermetalics grow as a function of temperature. * Th
Electronics Forum | Fri Jul 04 08:57:59 EDT 2003 | davef
If you think you have an intermetallic, soldering as probably done correctly. In that case, expect the solder to fail in the solder, just above the intermetallic. This the weakest portion of the solder, because the tin has be depleted to form the i
Electronics Forum | Tue Nov 29 22:32:51 EST 2005 | davef
The dissolution rate of nickel into tin is a lot slower than that of copper [into tin]. This results in a nickel-tin (Ni3Sn4) intermetallic that is only 0.25-0.75�m thin after a normal soldering process. The Ni-Sn intermetallic compound tends to be m
Electronics Forum | Mon Jun 21 12:08:17 EDT 1999 | C.K.
| I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), an
Electronics Forum | Thu May 01 16:36:49 EDT 2003 | blnorman
What is the best way to determine solder joint intermetallic composition? Metallography? XDS of the joint? Any input is appreciated.
Electronics Forum | Wed Mar 09 21:08:20 EST 2005 | KEN
It is not copper. It is copper / nickel and other variations of copper intermetalics.
Electronics Forum | Mon May 20 22:13:45 EDT 2013 | ultimatejoker
So u mean it is to form the intermetallic compound which is (Cu,Ni)6Sn5?
Electronics Forum | Thu Sep 21 20:59:55 EDT 2017 | davef
There is no standard minimum / maximum IMC thickness. * There needs to be an IMC * Thinner IMCs are preferred over thicker IMCs
Electronics Forum | Tue Oct 24 11:56:44 EDT 2017 | babymythird0421
As far as I know there is no standard thickness minimum or maximum thickness. It depends
Electronics Forum | Thu Sep 21 17:50:43 EDT 2000 | Bill Boles
Does anyone have a quick reminder for a PCB with immersion gold surface finnish going through a reflow profile: Which of the following statements is more correct? A: In order to minimize gold in the intermetallics of the solder joint, the board temp
