Electronics Forum | Wed Apr 05 02:27:20 EDT 2017 | soldertraining
Excellent document link you have shared. High Frequency signals reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect to the sending component.
Electronics Forum | Wed Dec 09 07:48:23 EST 1998 | EFData
Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?)
Electronics Forum | Mon Dec 06 11:49:52 EST 1999 | John Thorup
Ron - no clean = no water, de-ionized or otherwise. What you should determine is if no-clean is suitable for your end product (it likely is) Certain high frequency, high reliability, low level, environmental, or other conditions might suggest a wash
Electronics Forum | Thu Nov 08 00:10:55 EST 2007 | omidjuve
don`t we have any article about the manufacturing of high frequency board . and precautions that we should use ?
Electronics Forum | Tue Mar 07 06:23:56 EST 2017 | rob
Hi Westen, Yes, lots of things cause problems on an physical PCB compared to a simulated PCB. Noise, special laminates, harmonics etc. This is a good starting point: http://www.ti.com/lit/ml/slyp173/slyp173.pdf Rob.
Electronics Forum | Tue Apr 18 00:49:43 EDT 2017 | pcbfox
Hi , I have some documents on IPC satandard regarding the design , may can help you.
Electronics Forum | Wed Apr 19 04:19:31 EDT 2017 | pcbcart
Hey Westen, we have an article about misunderstandings and strategies on High-Speed PCB design, you might find some valuable info. Article address: http://www.pcbcart.com/article/content/high-speed-PCB-design-strategies.html If you have further co
Electronics Forum | Wed May 31 05:32:14 EDT 2000 | F.Frimpong
Hi All, I am looking to design some test structures on GaAs and High resistivity silicon for the high frequency characterization of interconect materials. (Organic substrate, vrs LTCC, Flipchip bump configuration: (metallurgy, shape height etc) conta
Electronics Forum | Fri Jan 03 16:14:37 EST 2003 | Jacques Coderre
Hi Jon, Flip Chip is chosen as an interconnect approach when one needs improved performance (high pin count, high frequency, noise reduction or improved heat dissipation.Another driver is size...Flip Chip greatly reduces the area and therefore is cho
Electronics Forum | Tue Mar 04 13:27:39 EST 2003 | MA/NY DDave
Hi Wow Genny, I don't think I could have given so much detail so fast. I have designed some high RF test designs for testing purposes to pass only the High Frequency, yet I didn't want to muddy the water with this other side. Now you did it well a
