Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Board Handling - Storage
TD-501 Fast Super Dryer Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/td-501 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Stands, 1 M ω Ground Wire Model: TD-501 Fast Super Dryer Capacity: 372
New Equipment | Board Handling - Storage
Eureka Dry Tech TD-2001 Fast Super Dryer Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/td-2001 Capacity: 1314 Liters Humidity Range: LESS THAN 20% Recovery Time: Recovers to ≤ 20% RH within 30 minutes after accessing doo
New Equipment | Board Handling - Storage
Eureka TD-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/td-101 Model: TD-101 Fast Super Dryer Capacity: 93 Liters Humidity Range: LESS THAN 20% Recovery Time: Recovers to ≤ 20% RH within 3
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Super powerful expanding desiccant to keep boards & microelectronics moisture free.... Much different than Silica Sand Beads. Also supplier of corrosion prevention treatments that are alternatives to Conformal coatings.
New Equipment | Board Handling - Storage
Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-101 Anti-static Glass, Anti-static Paint on Body and Shelves, Anti-static Stands, 1 M ω Ground Wire Model: SDC-101 Fast Super Drye
New Equipment | Board Handling - Storage
Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-2001 Model: Eureka SDC-2001 Fast Super Dryer Capacity: 1314 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% R
Technical Library | 2023-09-23 22:25:12.0
Moisture trapped within components and PBs presents a serious problem during the fabrication and assembly process. Too much moisture can lead to board failures when it is turned to steam during the reflow process.
