ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/paragon-materials
. When it comes to analyzing a new device or component, accuracy is everything. This new suite of software is dedicated to micro-materials testing which guides you through even the most difficult of failure analysis tests
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/2019_ICEET_Program.pdf
:30pm-2:40pm 2:40pm-2:50pm 2:50pm-3:00pm 3:00pm-3:30pm 3:30pm-4:00pm 4:00pm-4:30pm 5:00pm AM COURSE: Failure Analysis of Electronic Devices Martine Simard-Normandin, Ph.D., MuAnalysis, Inc
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) provide the best in the industry X-ray inspection solutions for production, engineering, R&D, and failure analysis. Easy to use, providing highest quality images with sub-micron resolution (market leading
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. Nordson DAGE bondtesters provide: System accuracy up to +/- 0.1% of selected load range Shear height accuracy up to +/- 0.25µm A range of optical systems for alignment, failure mode analysis and live recording
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X-ray inspection for PCB, electronics and semiconductor Wafer Characterization Inspection, metrology and testing for semiconductor News 29 Oct 2020 Designed for the most advanced failure analysis
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feature recognition and resolution X-ray systems not only within failure analysis laboratories but also within the production environment
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. Inspection Services From Research and Development to Failure Analysis, Nordson SonoLab’s unmatched combination of experience and technology ensures that
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/workshop-registration
* Company Full Address (Street address, city, state, postal code) Country Phone * Fax Email Address * User Level Advanced Intermediate Beginner Region of interest Device Information Part/Device Failure Analysis Production Screening Construction Analysis Device Qualification Process Control/Development R & D Screening
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/micro-materials-tester?con=t&page=9
. Fully automatic wafer… High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests:Correlation of Failure Mode and Loading Speed Nordson DAGE Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls Nordson DAGE Peter Koch of Nordson DAGE will Discuss Failure Analysis with X-ray at
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/paragon-materials-software
. When it comes to analyzing a new device or component, accuracy is everything. This new suite of software is dedicated to micro-materials testing which guides you through even the most difficult of failure analysis tests