Industry News | 2016-09-22 17:27:09.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 15, 2017, and will be displayed throughout the event, offering additional visibility.
Industry News | 2017-09-19 17:02:13.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Industry News | 2018-02-12 10:15:49.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 28, 2018, and will be displayed throughout the event, offering additional visibility.
Industry News | 2018-08-06 20:44:43.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, offering additional visibility.
Industry News | 2020-06-24 15:45:07.0
IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
Industry News | 2013-10-11 08:25:07.0
Manufacturers that don’t want to be caught off guard by a European Union (EU) conflict minerals regulation can learn about upcoming legislation directly from key government officials and hear what industry leaders are doing to prepare for compliance with EU and U.S. laws at IPC's Conflict Minerals: Complying with EU and US Laws conference, October 23, 2013, in Brussels.
Industry News | 2013-08-14 11:48:01.0
IPC – Association Connecting Electronics Industries® will host one-day conference, “Conflict Minerals: Complying with EU and US Laws” on October 23, 2013, in Brussels to help European and U.S. companies plan for compliance with current and future customer and legal requirements.
Industry News | 2016-05-05 20:10:24.0
IPC – Association Connecting Electronics Industries® and the Information Technology Industry Council (ITI) will host a conference series on “Critical and Emerging Environmental Product Requirements” this June.
Industry News | 2010-04-16 11:20:45.0
IPC has released updates to key standards that affect your business. New versions of printed board standards IPC-A-600 and IPC-6012 have been released, along with key assembly standards IPC-A-610 and J-STD-001. If you become a member now, you will be eligible to get free copies of all of these standards, saving up to $393. And, of course, as more new standards are published, you can request a copy within 90 days, adding to your savings!
Industry News | 2011-04-20 21:20:58.0
IPC — Association Connecting Electronics Industries® bestowed its highest corporate honors to TTM Technologies and Celestica. During the IPC Annual Meeting Luncheon held in conjunction with IPC APEX EXPO™, IPC awarded the Stan Plzak Corporate Recognition Award to Celestica and the Peter Sarmanian Corporate Recognition Award to TTM Technologies.