Industry News | 2018-02-14 10:19:15.0
Press Release DA 90 Low Temperature Die Attach Adhesive Series Materials
Industry News | 2018-02-14 10:21:37.0
Press Release DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials
Industry News | 2013-09-05 20:26:22.0
Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.
Industry News | 2013-04-29 12:50:23.0
Engineered Material Systems debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.
Industry News | 2013-01-21 08:57:51.0
Engineered Material Systems debuts its 561-50 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices
Industry News | 2014-11-07 10:35:14.0
AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.
Industry News | 2016-02-20 20:36:54.0
Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.
Industry News | 2018-03-12 17:42:02.0
Engineered Material Systems is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications.
Industry News | 2016-02-25 08:45:46.0
Akrometrix today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moiré or DFP systems (AXPs) can be upgraded with the new feature.
Industry News | 2013-10-22 14:45:08.0
Engineered Material Systems debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.
