Used SMT Equipment | Pick and Place/Feeders
Model: CP45F-NEO Mounting speed:14,900CPH(IPC9850) Component recognition range:1005(0402)～□22mmIC 0603(0201) ～ □12mm(option) Placement accuracy:±0.08mm PCB SIZE: 50×30×0.3～460&
Used SMT Equipment | Pick and Place/Feeders
Model: CP45FV-NEO Mounting speed:14,900CPH(IPC9850) Component recognition range:1005(0402)～□32mmIC 0603(0201) ～□42mm(option) Placement accuracy:±0.08mm/CHIP;±0.04mm/CFP PCB SIZE: 50
Our range includes board to board and cable to board connectors in a variety of high-reliability, high performance interconnect styles, and industry standard interconnect. Harwin connectors are available from our global distribution network. Harwin
Industry Directory | Manufacturer
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
Industry Directory | Distributor / Manufacturer
An international distributor of mechanical IC samples or "dummy" components, SMD production tools and equipment
Industry Directory | Manufacturer
Elscott specializes in low to medium volume PCB assembly. We manufacture to military specifications and can be RoHS compliant. We have 0201 chip capabilities and do quick turn prototyping.
Industry Directory | Manufacturer
The Smart Korea PCB is a high quality PCB Manufacturer & Supplier based in Korea, specializing in IC testing hardware products such as Probe Card, Load Board, Burn-In Board, Hi-Fix Board, Build-up Board and more.
Used SMT Equipment | AOI / Automated Optical Inspection
Description: Hello and thank you for your interest in our MVP AOI Machines For Sale.We have a total of (2)Ultra 18-20 MVP Automated Optical Inspection Machines,(1)CentOS based server. They were taken off line due to new machine installation would
Technical Library | 2014-05-29 13:48:14.0
Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance ( 30 μm) in dense 2-D arrays (180 ~ 180-µm pitch). Mechanical characterization shows that individual springs operate at approximately 150-µN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules.
Industry News | 2013-07-15 14:58:08.0
Mobility is the driving force in electronics.
