Industry Directory | Manufacturer
Vimic is expert in the design and manufacture of various types of fluid dispensing tools and a selection of Die Bonding Tools for customized applications. The offering includes Epoxy Stamping Tools, Pick-up Tools, Push up Needles.
Used SMT Equipment | THT Equipment
For sale great shape Automated Global Production Device Redial Lead Thru-hole lead component former. This machine is still supported by GPD and can b bought new. See links below. Contrary to popular belief, thru-hole technology is actually thriving
Dispensing tools can be defined as transfer of fluid from a container (usually a syringe) to substrate, one of the best options in meeting the requirement for adhesives in a wide array of packaging assemblies. In order to keep up with the rapid deve
Industry News | 2013-03-12 13:42:20.0
With new SIPLACE placement machines and many software innovations, ASM Assembly Systems underscores how important the SMT Hybrid Packaging trade show in Nuremberg has become. At Booth 7-204, the SIPLACE team will present innovations from both ends of its platform spectrum: With the SIPLACE X3 S, it unveils the latest generation of the successful SIPLACE X high-end platform, while the SIPLACE D1i is a new solution for the more price-sensitive SMT production segment.
Career Center | , British Columbia Canada | Engineering
Looking for an engineer or technician to do some contract work on the assembly, testing, and failure of analysis of microelectronics packagages. The individual needs to understand the process of gold wire bonding and eutectic die attachment. Knowle
Parts & Supplies | Other Equipment
We are specialized in providing electronic products that use for SMT JUKI machines, such as feeder, PCB, Nozzle, LM Guide, Cable bearer, sensor, motor,etc. All of our products are original new and with the most competitive price. Welcome to contact u
New Cut Tape Solution for ASM Siplace Smart Feeders
New Cut Tape Solution for ASM Siplace Smart Feeders
Used SMT Equipment | Pick and Place/Feeders
Unique, Flexible and Ultra Precise for Die Attach, Flip Chip and Standard SMT Placement. Component Size: 20mm x 26.5mm (Laser Recognition) 1.0mm x 0.5mm to 20mm Square (Vision Recognition) Fixed Front & Rear Feeder Banks (Optional Trolley Upg
Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrate
