Electronics Forum | Fri Jan 21 19:20:31 EST 2022 | SMTA-64304163
Can someone who designs IMS printed circuit boards advise us on how to document the materials on the drawing. We are looking for applicable specifications to reference along with the physical specs. The current design is 066 +/-.006. .059 al, .0028
Electronics Forum | Tue Oct 03 17:08:31 EDT 2023 | assuredtech
What Is FR4 Substrate Material? FR4, also written as FR-4, is both a name and a standard rating. The name is applied to the fiberglass-reinforced epoxy-laminated sheets used in printed circuit board manufacturing. However, the name also functions as
Electronics Forum | Thu Apr 27 21:00:32 EDT 2000 | Dave F
Scott: I�m not familiar with some of the things you�re talking about, but let me: * Agree with Russ & Peter regarding immersion silver. * Give some snips of information on the substrate side of things that might help you to tie this together. � FR-1
Electronics Forum | Sat Nov 14 08:00:34 EST 1998 | Earl Moon
| Also the preheating of the board is done to help evaporate any water/alcohol that is in the flux - water is a big problem in No-clean processes. From our experience, a temp range around 200f - no more than 220f is ideal for the bigger boards, but t
Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen
Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing
Electronics Forum | Thu Dec 12 07:37:13 EST 2002 | davef
Immersion plating appears like electroless, sorta, but is different chemically. Plating is converting metal ions in solution to metal on the board. Those metal ions are "converted" by adding electrons to them. The source of these electrons defines
Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F
John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa
Electronics Forum | Wed Feb 23 16:49:08 EST 2000 | Dave F
John we paced through the same question recently. Both automatic dispensers and printers can be used to deposit SMT adhesive or solder paste on substrates with a relatively high component density. Dispensers are superior to printers in terms of exa
Electronics Forum | Mon Oct 11 13:44:29 EDT 1999 | Dave F
Ken: Since Earl is no longer here, I guess I'll bite on this. Your questions are very broad and difficult to answer specifically. So, I'll give you broad and non-specific answers. | Hi, | | We are using mixed technology in our PCBA. Would like to
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