Electronics Forum | Thu Jul 25 07:44:18 EDT 2002 | krs
Dennis thanks for the feedback. I can confirm we have also had 'black pad' type problems on gold pcbs fitted with BGAs. It can be as you say impossible to detect on Xray. We try to avoid gold pcbs for this reason, preferring horizontal HASL even whe
Electronics Forum | Mon Sep 16 03:10:32 EDT 2002 | stefano_bolleri
Do you mean, rows of pins at the edge of the substrate, making it a SIP/DIP component? This is achieved by attaching leadframes with dedicated technology, and is a typical high-volume application. If you confirm this is what you are looking for, ther
Electronics Forum | Wed May 07 11:31:21 EDT 2003 | cyber_wolf
Well Dave, Check the number that is on your adhesive tube. They make several different types of adhesives for use on different substrates. The rep from Dymax recommended the 3073 for bonding to FR4. We use a Dymax HHL400 handheld curing light. Click
Electronics Forum | Sat Sep 06 21:50:09 EDT 2003 | Hoss
Sr. Assuming you are processing the garden variety 63/37 paste on FR4 substrates, a good starting point is to plan for 3.5 to 4.5 minutes of process time on the board. If you measure the total heated length of your oven and you use the range above,
Electronics Forum | Mon Sep 29 02:35:28 EDT 2003 | Sam
Hi Mantis. Has there been any changes in the BGA itself? One of our BGAs changed to a newer type, and after that we had problems with corner lifting. In that case problem was BGA's structure, there was mismatch in TCE between BGA's substrate and mo
Electronics Forum | Mon May 10 11:24:33 EDT 2004 | Charly
Encounter solder ball crack after reflow, found the solder ball is out of shape after reflow, cross section view found that the solder mask opening is not good ( when we do comparason with diff. supplier substrate.) Does the solder mask shape will af
Electronics Forum | Tue Sep 14 10:24:53 EDT 2004 | pjc
MPM is a printing machine design and mfg company based in Franklin MA USA. Printing machines are used to deposit hi viscosity materials such as solderpaste, adhesives and silver epoxy used by the electronics assembly and semi-conductor industry. The
Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco
Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching
Electronics Forum | Thu Nov 03 21:40:40 EST 2005 | davef
There maybe multiple drivers to your problems. * First, decreasing bond quality with time indicates a plating issue. What's the actual thickness of your gold and nickel on the pads? * Second, the no-sticks indicate contamination. If it's organic, p
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
