Electronics Forum | Tue Apr 27 07:50:09 EDT 2021 | jeremy_leaf
@KWalker I think that could be the case. Though I read somewhere a while back that nickel oxidation can be quite tough to remove, even with flux. Am I wrong about that?
Electronics Forum | Tue Apr 27 19:08:04 EDT 2021 | emeto
Jerry, just out of curiosity, why can't you use flux? Flux is essential part of soldering and it is there for multiple reasons. Flux we can also clean afterwords - even No Clean.
Electronics Forum | Tue Apr 27 21:22:57 EDT 2021 | kwalker
The fact that your cleaning didn't really help reinforces that it probably is oxidation. Cleaning won't remove that.
Electronics Forum | Wed Apr 28 15:51:52 EDT 2021 | duchoang
Could you share some pictures? Without any flux or paste, how could you place preforms on pads? SMT Pick and Place ?
Electronics Forum | Wed Oct 14 08:32:45 EDT 1998 | Earl Moon
| Dear Mr. Earl Moon | please give me all your information and pictures to know the reason of the voids formation caused by the HASL oxidation. | I am very interested to this experience. | | With Best Regards | V.Longobardo | | | | I will assemble
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Electronics Forum | Wed Apr 28 06:26:15 EDT 2021 | jeremy_leaf
@Evtimov I can't use flux as the components being soldered can't cope with any contamination whatsoever. Even an ultra low solids no-clean flux will be too much. I also can't clean the boards after soldering due to any residual contamination from the
Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881
PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro
Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon
| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn
Electronics Forum | Mon Apr 26 17:09:05 EDT 2021 | kwalker
Sounds like you are getting oxidation of the nickel under the gold layer. If the gold is porous it will allow the nickel underneath to oxidize, which is the dark dull layer you are seeing, and why when you apply flux it solders just fine - the flux i
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