Electronics Forum | Thu Aug 26 07:35:32 EDT 1999 | Robert Meston
For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. Does anyone have any new ideas on how t
Electronics Forum | Tue Jul 20 08:37:42 EDT 1999 | Dave F
| First of all, I'm a young Spanish so sorry for my English | | I'm looking for a smd single pin connector. I need it to solder it in a alumina's substrate. | | Please. can anybody help me ? | Baddia: That everyone with English as their first la
Electronics Forum | Fri Jul 23 06:44:33 EDT 1999 | George Verboven
| First of all, I'm a young Spanish so sorry for my English | | I'm looking for a smd single pin connector. I need it to solder it in a alumina's substrate. | | Please. can anybody help me ? | Go to the following adress: http://www.keyelco.com/ke
Electronics Forum | Tue Mar 16 15:34:14 EST 1999 | CHUCK B
My engineering Dept. has informed me that they want to start using pins, on an aluminum substrate in the smt process. Pins are interconnect for daughter bds. Dia. of pins 0.020" 0.040" 0.080" flat bottoms 1) Does any one know how to hold pins
Electronics Forum | Mon Mar 15 06:27:18 EST 1999 | Joe Manzur
Hello, Is there anybody screen printing glue on the underside of the PCB, when there are through leads, dip, axial & radial parts already cut and clinched into the board? Is there anybody just printing glue on a flat substrate? If the answer to e
Electronics Forum | Thu Mar 18 05:35:45 EST 1999 | Joe Manzur
| Hello, | | Is there anybody screen printing glue on the underside of the PCB, when there are through leads, dip, axial & radial parts already cut and clinched into the board? | | Is there anybody just printing glue on a flat substrate? | | If t
Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F
| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel
Electronics Forum | Fri Apr 17 14:37:13 EDT 1998 | Justin Medernach
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, Try
Electronics Forum | Mon Sep 17 08:40:04 EDT 2001 | dave_bond
I have done a search of the Forum and didn't really see what I was looking for. We could be doing a 12" x 10" x .060" single sided ceramic PCB with all surface mount devices. Are there any "secerts" or "things to watch out for" when processing cerami
Electronics Forum | Wed Jun 12 03:26:03 EDT 2002 | edahi
We are currently having gross tombstoning with 0402 capacitors. We are using HiPb Solder Paste mounted on Laminate substrates. We are assembling Flip Chip BGA's. Temp @ Reflow is around 230-240 C to meet the thermal requirements for both die bump
