Electronics Forum | Mon Jan 29 12:09:55 EST 2018 | fluxgate
I am working on a magnetic sensors design and noticed that my measured magnetic field bias shifts over time. I have studied the bare PCB and measured that it can be magnetized with a strong magnet. I tested two blank (unpopulated PCBS). The first PC
Electronics Forum | Thu Dec 14 21:54:50 EST 2000 | Joseph Scott Dowsett
I am student at Northern Illinois University and am doing a senior design project on applying castellated solder pads (pads on the side of the substrate) to a hybrid circuit. I have had difficulty finding related articles. I found this website and
Electronics Forum | Wed May 31 05:32:14 EDT 2000 | F.Frimpong
Hi All, I am looking to design some test structures on GaAs and High resistivity silicon for the high frequency characterization of interconect materials. (Organic substrate, vrs LTCC, Flipchip bump configuration: (metallurgy, shape height etc) conta
Electronics Forum | Sat May 27 14:13:35 EDT 2000 | Madan Mohan
Hi Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that higher temperatures are needed in rework machine compare
Electronics Forum | Thu Feb 15 07:25:05 EST 2001 | Nick
0.5um(Ni~6.5um) after reflow(data taken in 48hrs).But after performing temperature cycle test ,the former aging rate(from the shear strength ) seems faster than the latter.Why!?Someone call this the 'precipitation hardness',but what actually is it! A
Electronics Forum | Wed Sep 20 10:00:40 EDT 2000 | Erick Russell
Yes, some testing of soldering chip capacitors onto ceramic substrates with high temperature paste proved successful. Die attachment can be achieved using this technology as well. The underfill of the die becomes a critical factor in rework potentia
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Tue Dec 28 20:31:48 EST 1999 | Jim
Justin, I have a customer who is considering changing from TH to SMT, but his preliminary reliability testing yielded solder joint failures, because his product must endure severe temperature swings. He can't change to an expensive substrate, or he'
Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik
I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel
Electronics Forum | Fri Sep 17 23:59:40 EDT 1999 | JAX
| | | HI everyone, | | | | | | We are using a Siemens ap-25 screen printer, in the past we have not had any problems with adhesive placement until a couple of weeks ago. It seems the x axis has decided that it should be set somewhere between .00
