Electronics Forum | Tue Feb 03 13:39:08 EST 2009 | grics
Good morning Jamie. I work at a CM and can offer some input on process flexability. I do not have any data on how reliable the coating is but I can say that they are both very difficult to control. Will you be selective coating or full coating? Ho
Electronics Forum | Wed Dec 13 11:24:08 EST 2000 | Wolfgang Busko
Hi George, bad luck! That�s why we professionals get so much money for it. Those "thingies" are mainly capacitors or resistors. If a capacitor is missing you might with luck not even notice it. A resistor, that�s different, you will notice it, what
Electronics Forum | Wed Dec 13 11:24:10 EST 2000 | Wolfgang Busko
Hi George, bad luck! That�s why we professionals get so much money for it. Those "thingies" are mainly capacitors or resistors. If a capacitor is missing you might with luck not even notice it. A resistor, that�s different, you will notice it, what
Electronics Forum | Wed May 17 11:19:44 EDT 2000 | John Thorup
Hi Dave It sounds like you do pretty much what we do. A couple of points: If your machine allows, open, fill and seal the dross container inside the machine. Otherwise, the auxillary exhaust as you describe is a must. Be gentle in your movements. Don
Electronics Forum | Tue Feb 27 18:16:42 EST 2001 | davef
I have never seen excess tin [heard of it, just never seen it]. Excess lead yes, but tin no. See, tin oxidizes faster than lead. This means that dross has a higher tin content than the solder in the pot. So, with a very high dross machine, we regul
Electronics Forum | Wed Mar 14 16:01:39 EST 2001 | Rob Fischer
Not necessarily. Maybe just a little over > sensitive...? > > I though Bill provided > considerable insight relative to the process and > the original question. There was a good answer in > there. I also thought that he provided more > specifi
Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri
The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav
Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef
Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l
Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F
Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �
Electronics Forum | Wed Oct 06 04:23:09 EDT 1999 | Brian
| | I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via
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