Electronics Forum | Mon Oct 19 17:45:25 EDT 1998 | John Gregory
Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach
Electronics Forum | Wed Jun 17 14:46:18 EDT 1998 | Robert Smith
1. I need to be able to probe into my product's substrate which has all components in die form. I would need to be able to bring out any pad information for hookup to a scope or any other external piece of equipment. I do not have the convenience o
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef
First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i
Electronics Forum | Wed Apr 05 11:55:28 EDT 2006 | Cristina Oanca
I am working on a Substrate attach process. The package is gold plated, the preform is AuSn and the backing on the substrate is PdAg. I am using a Sikama reflow furnace. The profile has a 50 sec dwell time. I am over 280 degees C for a little over 1
Electronics Forum | Wed Mar 25 20:00:32 EDT 2009 | davef
We are not sure what you mean by "any type like plastic, aluminum, stainless steel etc?" Binks [(US Corporate Offices), ITW Industrial Finishing, 195 Internationale Blvd., Glendale Heights, IL 60139; 630-237-5000 888-992-4657 http://www.binks.com] m
Electronics Forum | Sat Aug 29 21:42:46 EDT 2015 | sarason
When I made my previous reply, I don't think I was very clear in what I said, so like any politician I will rephrase my response to the question. My intent was that the board didn't have enough soak time leading up to final reflow. So what was happen
Electronics Forum | Sat Oct 22 13:37:46 EDT 2016 | greglac
I am currently working on a custom IC where we plan on using Cu pillars at 80um pitch. I'm am trying to narrow down a packaging solution. My requirements are as follows: 40um Line Width/Space Capability (or finer) 4 layers low loss at mm-wave
Electronics Forum | Wed Jul 12 08:49:38 EDT 2017 | williamaxler
I have a few LED pcb's that have an aluminum > substrate that are ridiculous to rework. They > heat-sink like crazy and I can't reflow the bad > LED's, no matter how much heat I apply. Any > suggestions on techniques or equipment to use? > I ha
