Electronics Forum: wetting (Page 162 of 182)

Reflow with lead-free 96.5 /3/0.5 No-Clean T4 brown-orange burn color on parts

Electronics Forum | Fri Dec 20 18:48:18 EST 2019 | rhormigox

Reflow with lead free 96.5 /3/0.5 No-Clean T4 brown-orange burn color on parts While I have been an observer for years, now I am mostly new into reflow process. I tried to reflow a big 4 Layers board and without knowing much about solder pastes oth

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 15:51:36 EDT 1999 | JohnW

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Tue Jun 08 11:54:17 EDT 1999 | Steve Skinner

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef

We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng

Re: I wonder

Electronics Forum | Fri Sep 10 11:45:09 EDT 1999 | Scott S. Snider

| scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X's | for defect. To know major X's with DOE we need a good measurement equipment.

Re: wave solder process

Electronics Forum | Thu Jun 17 15:18:54 EDT 1999 | Earl Moon

| Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | for example: | | Solder Bridge | 1.verify amount of flux been aplied. | 2.verify turbulance on your solder wave. | 3.etc.

Re: wave solder process

Electronics Forum | Thu Jun 17 19:52:57 EDT 1999 | Tony

| | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | for example: | | | | Solder Bridge | | 1.verify amount of flux been aplied. | | 2.verify turbulance on your solder w


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