Electronics Forum | Tue Jun 25 12:10:10 EDT 2019 | slthomas
The profile (temperature curve) is absolutely a function of both top and bottom zone settings as well as conveyor speed, blower speed, etc.. Certainly when you perform profiling you have to consider both top and bottom heaters when you make adjust
Electronics Forum | Fri Oct 11 03:56:39 EDT 2019 | chrislandafont
Hi Tsvetan, Yes, I've heard it's difficult to program but good once it gets going. At the moment, I'm working through the manuals, but can't find a step by step guide, just lots of reference material on how to do things, but not knowing what orde
Electronics Forum | Fri Dec 20 18:48:18 EST 2019 | rhormigox
Reflow with lead free 96.5 /3/0.5 No-Clean T4 brown-orange burn color on parts While I have been an observer for years, now I am mostly new into reflow process. I tried to reflow a big 4 Layers board and without knowing much about solder pastes oth
Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis
The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)
Electronics Forum | Fri Jun 04 15:51:36 EDT 1999 | JohnW
| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI
Electronics Forum | Tue Jun 08 11:54:17 EDT 1999 | Steve Skinner
| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
Electronics Forum | Fri Sep 10 11:45:09 EDT 1999 | Scott S. Snider
| scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X's | for defect. To know major X's with DOE we need a good measurement equipment.
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