Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Thu Jan 11 00:52:12 EST 2007 | behrsam
Mario, I tried a couple of profiles. In all cases the preheat ramps fairly slow, while the reflow utilizes the radiative heater to speed to reflow as quick as possible. I tried a quick profile and a slower one. The quick has about 15-20 sec at pre
Electronics Forum | Tue Jan 23 10:22:27 EST 2007 | Peter W.
Hello, maybe you are experiencing the so called "head in pillow" defect. It is especially critical for larger BGA. The defect comes from the deformation during reflow of the BGA, so that some of the balls are lifted and have no contact during liquid
Electronics Forum | Sun Mar 18 23:01:11 EDT 2007 | diesel_1t
Hi there, I want help on the following issue. Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating
Electronics Forum | Tue Aug 07 19:32:40 EDT 2007 | davef
Zinc from the brass diffuses into the solder and reacts with tin causing dezincification. Dezincification is a specific type of de-alloying, or selective, leaching corrosion of brass fittings. This type of corrosion selectively removes zinc from th
Electronics Forum | Wed Oct 17 09:19:23 EDT 2007 | actech
This box has the I/O card mounted sideways under it's own cover on the side of the main box. The CPU card is the bottom card. The Two driver cards X/Y and R/Z are side by side and mount to a steel base pannel with there relays at the back. but even i
Electronics Forum | Wed Jun 18 13:08:52 EDT 2008 | sleech
Dave: You are spot-on right! The major hurdle is that 70 degrees C is below the boiling temperature of water. Only a near zero relative hudity chamber will cause the ingested moisture to migrate from a package. There is one facet of the 70 degree p
Electronics Forum | Fri Apr 04 08:49:45 EDT 2008 | ck_the_flip
Define "expired" though... 1 week? 6 weeks? 1 month? 6 months? Unrefrigerated life is generally 30 days. If paste has been stored refrigerated at manufacturer recommended temperatures, what would you guys do, like say, if you owned your own shop
Electronics Forum | Wed May 07 14:54:38 EDT 2008 | realchunks
OK, you may be using this forum for your political rants - but if not, I will appease you one more time: Issue one at hand: Blame a political leader for my mistakes. I wish it were that easy. I'd blame Oprah for my top side wetting issues. Issue
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