Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW
Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image
Electronics Forum | Thu Nov 19 08:20:04 EST 1998 | Earl Moon
| | | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave so
Electronics Forum | Thu Nov 19 09:01:00 EST 1998 | Dave F
| | | | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave
Electronics Forum | Mon Oct 25 15:45:11 EDT 1999 | Dave F
Joe: Lemme see, you�re talking about controlling your manufacturing process within 4.6 defects per 100 opportunities or a 4,600 dpmo rate, a cumulative 99.95 acceptance rate, or a �2 sigma process, right? So, it�s fairly basic stuff, eh? First, yo
Electronics Forum | Mon Jun 07 10:57:31 EDT 1999 | Dave F
| | | | Where I can find some informations about repairing of SMT boards? | | | | | | | | Thanks | | | | | | | | Marcos | | | | | | | A first place to start is IPC's 7711 and 7721 encompasing repair, modification, and rework procedures. | | | |
Electronics Forum | Fri Mar 12 13:30:06 EST 1999 | Bill Schreiber
Dear Scott, You are correct in questioning the chemistry portion of the process. However, I am couriuous as to why you selected DEK as a stencil cleaner. The most important part of any cleaning process is always the chemistry. How you deliver the c
Electronics Forum | Fri Mar 12 13:40:53 EST 1999 | Bill schreiber
In a nutshell, you should be looking for a chemistry first, then look for a machine. Hopefully, they will be from the same source. | Dear Scott, | You are correct in questioning the chemistry portion of the process. However, I am couriuous as to w
Electronics Forum | Thu May 21 22:15:05 EDT 1998 | Earl Moon
| | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently
Electronics Forum | Fri May 22 11:56:04 EDT 1998 | Bill Schreiber
| | | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recent
Electronics Forum | Fri Nov 05 18:47:31 EDT 2010 | eadthem
I'm guessing when you say bare board you mean wet paste only? When you say the pads move slightly are your boards warped at all at the Vscore? What we do is use per modual fids. first you delete or don't make panel fids and then theres a option wh
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