Electronics Forum: wetting (Page 148 of 182)

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.

Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to

Re: Poor solder joints on QFP 100's

Electronics Forum | Thu Dec 16 16:46:47 EST 1999 | Mike Naddra

Steve , I use a general set of guidlines when developing reflow profiles: Ramp rate to 140 deg C - 50-60 seconds Time at preheat (140-160 deg C) - 90-120 sec Time above liquidous (183 deg C) - 45-90 sec Time at peak (215-225 deg C) - 9-12 sec peak t

Re: Dull Solder

Electronics Forum | Fri Nov 12 08:55:43 EST 1999 | Wolfgang Busko

Hallo Edmund, what does dull mean in your case ? It�s nearly impossible to say something about it without more information. Dull or shiny isn�t a clear or better no indicator for good or bad. Some companies add other metalls to the solder to get rid

Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Wed Sep 29 23:54:07 EDT 1999 | Dreamsniper

Hi everyone, Greetings! I�ve got a 2-layered through-hole PCB�s having the following problems: Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB Insufficient Solder and some solder never make it to t

Re: Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Thu Sep 30 12:29:01 EDT 1999 | Dave F

| Hi everyone, | | Greetings! | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | Insufficient Solder and some solder ne

Re: Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Thu Sep 30 21:37:44 EDT 1999 | Dreamsniper

| | Hi everyone, | | | | Greetings! | | | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | | Insufficient Solder an

Re: Wrong Part on Siemens

Electronics Forum | Wed Sep 22 22:21:31 EDT 1999 | JAX

| Hi All, | | We have 19 Siemens machine running here and lately I was assigned to come out with a proposal on the wrong part issue on Siemens Machines. All of our machines are equip with siemens part verification in which there the part barcode is

Re: MicroBGA printing problem

Electronics Forum | Wed Sep 22 21:23:03 EDT 1999 | se

| | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | The stencil is 6 mil thick, laser cut and electo-polished. | | The apertures are 12 mil in diameter with 20 mil pitch. | | We

Re: MicroBGA printing problem

Electronics Forum | Thu Sep 23 12:47:48 EDT 1999 | Earl Moon

| | | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | | The stencil is 6 mil thick, laser cut and electo-polished. | | | The apertures are 12 mil in diameter with 20 mil pitch.

Re: I wonder

Electronics Forum | Thu Sep 09 21:50:53 EDT 1999 | kyung sam park

2 will have enormous impact on every other process. | | thank in advance. scott. I appreciate your sincere answer. would tell me the hint about printer if i's possible To tune our smt process we have to know what is the major X's for defect.


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