Electronics Forum | Mon Apr 30 10:06:13 EDT 2001 | CAL
John- Just few ideas at random (brainstorming) - While times are slow invest in training of your current staff. There are some great training facilities out there offering valuable knowledge. Knowledge is a valuable thing to have and will prove to be
Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis
So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free
Electronics Forum | Tue May 08 03:14:12 EDT 2001 | sinclair
We started our first ENIG process recently and to our surprise, we have many failure on the one and only BGA on the board. The BGA is a 31 mils pitch plastic. Sending the PCBA to 1 cycle of heating/cooling @ 70/-5 degree C yield 40% of failure. With
Electronics Forum | Mon May 14 17:14:07 EDT 2001 | davef
First, consider checking the fine SMTnet Archives. Look for threads on "white tin", in addition to "immersion tin". We�ve had a cuppla good ones of late. Merix [http://www.merix.com] gives a good comparison of different solderability preservatives
Electronics Forum | Mon Jun 25 20:39:08 EDT 2001 | ianchan
Hi mate, no complete info given from what i see, so just some humble comments, mayhaps you review : 1) PCB pad finishing - Copper+nickle plated? coz if so, nickle is a KILLER to good solder wetting. what we did back here, was to HAL coat the nickle
Electronics Forum | Wed Jul 25 23:35:18 EDT 2001 | mugen
my guys SOP : Round #1 1) take double-side tape, and peel it flat to the PCB. 2) process this PCB only through P&P SMT. 3) confirm the SMD placement Round #2 4) take thin plastic sheet and tape corners flat to the PCB. 5) solder paste print over t
Electronics Forum | Wed Jul 25 23:37:11 EDT 2001 | mugen
my guys SOP : Round #1 1) take double-side tape, and peel it flat to the PCB. 2) process this PCB only through P&P SMT. 3) confirm the SMD placement Round #2 4) take thin plastic sheet and tape corners flat to the PCB. 5) solder paste print over t
Electronics Forum | Sat Feb 05 09:13:39 EST 2000 | Dave F
Hany: In response to your questions: 1- In a double wave solder M/C, is possible to completely eliminate the second wave without affecting the quality of the solder joints? Many w/s machines have a turbulent wave and a smooth wave. The turbule
Electronics Forum | Mon Jan 31 14:08:26 EST 2000 | Ashok Dhawan
I have got a number of assemblies back from a customer with feedback that the solder fillet is less than 25% of chip height per IPC-Standard-610B Class 2. Most of my joints are having good wetting but fillet height does not meet min ht requirement of
Electronics Forum | Wed Jan 12 20:20:54 EST 2000 | Bene
I had the opportunity to spend time with a demo and one on one with the inventor of the Ersa scope inhouse a few months ago. I see the scope complimenting X-ray inspection but not as a substitue. It allows you to view attributes of a solder joint t
