Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy
Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of
Electronics Forum | Mon Jun 25 20:47:09 EDT 2001 | davef
Much of the focus of pick & place machine supplier development efforts seems to directed towards either: * Head location detection, adjustment, and control. OR * Component location prior to pick-up. OR * Component position error correction after pick
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
Electronics Forum | Thu Feb 10 22:55:50 EST 2000 | Dave F
Fred: I'm tryin' my darndest to be good, because, for whatever stupid reason, I feel that you're making an honest inquiry and not just floating something to find the biggest sucker. If only Earl was still here, he'd always bite on stuff like this.
Electronics Forum | Mon Jun 26 20:34:14 EDT 2000 | Dave F
Gary: Allow expand on this topic a bit. Back in the gray skied past when people wore calculators on their belts, rather than pagers n Palms, and didn�t drink California spill, they used HASS that you mentioned and HALT (Highly Accelerated Life Test
Electronics Forum | Tue Jun 12 18:06:17 EDT 2001 | davef
The criterion you use will depend on the test method you select. For minimum requirements, look at J-STD-001C, Para 8, "Cleanliness Requirements". I figure that you�d measure the residues on a lot of your current product, measure the res on a lot o
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
Electronics Forum | Mon Oct 18 05:23:01 EDT 1999 | Brian
Steve What do you mean by better? More/less activity? fewer retouches? longer shelf life at ambient temperature? less hygroscopicity? longer open time on the stencil? easier to wash? easier to treat waste water? easier for washing machine maintenanc
Electronics Forum | Tue Sep 28 05:28:46 EDT 1999 | Wolfgang Busko
| | | I'm trying to start a small SMT contract shop and I need | | | assistance in selecting equipment. Quad seems to be the | | | leader but if there is something else out there that can | | | better suit me please let me know. My shop starting out
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