Electronics Forum: wetting (Page 145 of 182)

3355-11 Uh oh!

Electronics Forum | Wed Jun 24 13:46:41 EDT 1998 | Chris Kelly

Brian, a couple of things really stick out here... 1) You are spraying what is referred to here at the CATT as "PINK DEATH" The 3355-11 is about the most active/aggressive flux you can get your hands on. I am concerned about both the condition

Non-wetting on QFP lead

Electronics Forum | Wed Nov 21 19:45:36 EST 2001 | Yngwie

Hi Guys, I need help. I�ve a trouble with non-wetting problem on the lead of 208 pin, 20 mils pitch QFP. We are on intrusive reflow. I never faced this problem before on this product after running them for about 2 years now. This occurred on one pa

Unusual solderability issue

Electronics Forum | Thu Apr 15 10:05:50 EDT 2010 | dwonch

Hi all, Long story ahead.... We are having issues with board vendors on some of our higher layer count (thick) boards. Specifically under BGAs with high aspect ratio vias (14:1). We are using ENIG finish and a lead free process. Basically we get t

Re: Soldering on a Ground Plane

Electronics Forum | Thu Feb 10 22:31:11 EST 2000 | Dave F

CK: If you�ve done everything under the sun process-wise at the wave: different fluxes, more heat, less heat, more contact time, and less contact time; and are running out of ideas; let me table some thoughts. � "Don�t mess with Mother Nature."

Re: Soldering on a Ground Plane

Electronics Forum | Fri Feb 11 10:14:54 EST 2000 | C.K.

Dave, to answer your questions, point-by-point: � Just out of curiosity, how are second side, skippy components oriented on the board with respect to the wave? The SMD's are all oriented in the "correct" direction with respect to wave direction(i

Reflow Profile Dry Out Stage

Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris

I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90

Re: silver finishes on pcbs

Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB

Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol

Re: BGA problem: open after reflow

Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef

Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo

Re: De-wetting on Immersion Silver finish board

Electronics Forum | Fri Aug 25 05:23:46 EDT 2000 | Wolfgang Busko

Hi Murad, like with many other questions it�s hard to judge without seeing the effect. Assuming that this site you�re talking about is well equiped with knowledge and that they handle their processes normally to everybody�s satisfaction it�s obvious

Re: Measuring Board Deflection

Electronics Forum | Thu Jul 13 04:01:02 EDT 2000 | JohnW

Dave, Firstly..how the heck are you?..been a while.... Ok so I'm running an Electrovert Electra witha hot gas knife, & I've got large server boards going over the wave. I've seen us loose chip, mainly Tants on the hot gas knife...ain't good especia


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