Electronics Forum | Wed Jun 30 10:00:33 EDT 1999 | Mcox
| | | | | | | | snip | | | | | | | | | John and Dave, | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the pa
Electronics Forum | Wed Jun 30 11:07:16 EDT 1999 | Earl Moon
| | | | | | | | | | snip | | | | | | | | | | | John and Dave, | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us d
Electronics Forum | Sat Sep 26 19:09:17 EDT 1998 | Graham Naisbitt
As an addendum to Daves posting, please consider that: There is no such thing as no residue fluxing. A no-clean must herefore, have benign residues - in other words, they are not as efficient at removing surface oxides to enable good solder joints. S
Electronics Forum | Fri Jun 02 17:33:51 EDT 2000 | Dave F
Hey CK, we�re all sodder googoo�s ... wanna be gurus Why donchu tell �em not to put sodder in your vias? Er, makit so the sodder won�t flow out of the bottom of the vias and cause dem stalactites? OK OK, here�s wacha do, modify the second side ste
Electronics Forum | Sat May 06 08:46:46 EDT 2000 | Dave F
Sal: Now you�re talkin�, buddy!!! Darrell is correct. All things being equal, thermal relieved vias (and through holes) should be the hottest spot on the board at reflow temperatures. Vias are gonna take on solder like drippin�s take to biscuits.
Electronics Forum | Thu Sep 30 15:06:05 EDT 1999 | Dave F
| Guys & Gals, | | I am at present instigating a formal method of recording and tracking any "process" trials that we may wish to run, such as a new paste, different packaged device etc; | | I started with a simple form.....too simple, but now I th
Electronics Forum | Thu Jun 03 22:18:36 EDT 1999 | Dave F
| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The
Electronics Forum | Fri Jan 15 15:06:30 EST 1999 | Earl Moon
| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have
Electronics Forum | Fri Jan 15 15:17:21 EST 1999 | Earl Moon
| | Hello, | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | So far, the tests I can think of performing, and tha
Electronics Forum | Thu Jul 02 15:23:15 EDT 1998 | Justin Medernach
| | I'm having a problem getting good reflow on gold sufaced boards. The profile looks good and I have adjusted it both hotter and colder and adjusted the various times ( soak, reflow ) to no avail. What realy gets me Is that a month ago we built som
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