Electronics Forum | Wed Aug 09 15:06:17 EDT 2023 | SMTA-64386426
The first thing I do when looking at a part relative to stencil design, is determine the coplanarity per the data sheet. Ideally your stencil thickness should be equal to, or if needed, greater than the coplanarity. You want the solder paste to com
Electronics Forum | Fri Feb 16 09:01:05 EST 2024 | emanuel
I am confused about the parameters of the reflow profile needed to solder lead free components. We assemble boards for automotive modules required with leaded solder paste. The boards have ENIG finish. The problem is that I see some wetting issues, v
Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
Electronics Forum | Fri Jun 04 15:04:16 EDT 1999 | Earl Moon
| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The
Electronics Forum | Tue Apr 13 18:39:24 EDT 1999 | Tom B
| | Netters, | | | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | | | 1. Kester 293 no clean | | 2. 2.1 C/s for 30s to 150 C | | 3. .5 - .7 C/s f
Electronics Forum | Tue Apr 13 23:08:56 EDT 1999 | Jeff Sanchez
| | | Netters, | | | | | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | | | | | 1. Kester 293 no clean | | | 2. 2.1 C/s for 30s to 150 C | | | 3.
Electronics Forum | Tue Jan 12 15:11:20 EST 1999 | Earl Moon
| | I have an Electrovert UPK 660c fitted with IR preheats top and bottom. We assemble a large range of multilayer backplanes and I was wondering if there are any advantages in changing to convection preheats.Has anybody got any views on the subject.
Electronics Forum | Fri Nov 27 13:04:47 EST 1998 | Phillip Hunter
| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the
Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory
Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W
Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan
| | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusive R
