Electronics Forum | Tue Sep 04 10:48:49 EDT 2007 | lloyd
How do other people check their solder joint strength after a process change? For example, say you are getting wetting problems and you feel that a change to the reflow profile may help, or perhaps a slight change to the stencil aperture to reduce so
Electronics Forum | Tue Jan 15 21:44:05 EST 2008 | davef
We believe that tip tinners reduce the life of the tip, also. Why do you use such a product? We like using solder paste to clean solder tips. Place expired solder paste in a covered container. Open container and dip the tip. It comes out clean and s
Electronics Forum | Thu Feb 14 23:37:38 EST 2008 | operator
That is bizarre. I would have to say that you need to do a test on the PCB to test solderability with an iron like mentioned before. If you don't find that the pads are contaminated or masked over lightly and the pads do take solder effortlessly, you
Electronics Forum | Thu Apr 10 08:23:27 EDT 2008 | scottp
If I read you right the issue is mostly with components from one supplier. I'd suggest looking at the components under a microscope. Also, if you have some old pre-tombstoning parts from this same vendor take close-ups of both and compare them side
Electronics Forum | Thu Jun 05 18:11:53 EDT 2008 | jlawson
Also coating costs depends on solids content vs final dry film thickness. Some newer UV coatings are 100% solids, so what you put down you get on the PCB after cure, use no solvents at all. So a cost to look at are qty of PCB per litre of material. T
Electronics Forum | Tue Jul 22 09:35:06 EDT 2008 | dfhoadle
I hope that we have not lost much quality, but am still bothered by the way our select x is working. It seems to do very well when I can get the nozzle head within 5/1000 of an inch to the board as it passes. However, when I increase that distance
Electronics Forum | Thu Jul 10 15:38:36 EDT 2008 | ck_the_flip
Amen to that Patrick. I am from a traditional Engineering background myself - they never taught wave solder in school. My curriculum was mostly theory and labs. When I got out, I read all the soldering books available at the time and also watched s
Electronics Forum | Fri Jul 18 14:36:17 EDT 2008 | proy
I have a QFN which we are adding after process. (it was not available the day we ran the 4 prototypes.) We have removed most of the solder on all the pads, My plan was that a LITTLE solder on the center pad would wet and center the device (using a g
Electronics Forum | Thu Aug 28 08:43:56 EDT 2008 | rgduval
You wouldn't think that placement would affect dewetting or solderability....I wouldn't have either, until it was the only thing left in our process, and when we changed it, things got better. I couldn't begin to explain why, either. The only concl
Electronics Forum | Tue Sep 02 15:29:36 EDT 2008 | bvdl
small pads like 0402 tend to get hot quite easily. looks like excessive heat is your problem here. pads are wetted, component leads are not. this means solder paste flux on top layer was exhausted before entering in reflow. your profile is the 'in-be
