Electronics Forum | Fri Sep 17 13:24:27 EDT 2004 | Bob R.
I also agree with Russ - we use step stencils when we have to but generally try to avoid them because the print isn't as consistent as with a single thickness stencil. Many of our products are for harsh environments so we do a lot of thermal cycle a
Electronics Forum | Wed Feb 20 15:00:12 EST 2008 | mulder0990
Reading the original post.. Floyd, do you remember the old overhead projectors back before we had the new fancy video projectors? Just get a clear sheet of that plastic and print your outline on that. Put that sheet over the stencil and presto, you
Electronics Forum | Fri Jan 03 12:01:46 EST 2003 | jax
Alot of the companies out there use Standards developed internally, centered around there paste, equipment, and reflow processes. Normally you will see either 5mil or 6mil stencils used for everything in house with the exceptions of specific boards.(
Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
Electronics Forum | Tue Jul 02 15:50:28 EDT 2002 | blnorman
FIrst, be a doubting Thomas and never trust supplier propaganda sheets, do your own testing. How often do you knead the paste? We have a standing requirement that if the paste printer is idle for 30 minutes, we have a minimum of 4 kneads before pri
Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
Electronics Forum | Wed May 22 13:40:24 EDT 2002 | Hussman69
Boy, I step out for a bit and everybody picks on me (just joking). I believe I may have been off base a bit. Checking every bit of your stencil design is very good - I do that too. I calculate LXWXH and reduce or over print where needed, depending
Electronics Forum | Mon Aug 02 12:28:41 EDT 2010 | tselvan
to prevent solder paste printing defects
Electronics Forum | Wed May 07 08:16:58 EDT 2014 | emeto
It really depends on pad design and other component on the PCB. Most of the time I run 0201s I have microBGAs on the board and usually print 3mil. Reduction will depend on the paste. For leaded paste you will have reduction (about 10% or so).For Lea
Electronics Forum | Tue Jul 10 13:45:23 EDT 2001 | markhoch
We're stencil printing a Loctite 3614 Chipbonder adhesive, and we're using BioAct SC-10 presaturated wipes to clean the stencil after printing, without much luck. Operators are not able to remove all adhesive material left in the aperatures, and aft
