Electronics Forum | Tue Sep 04 09:12:35 EDT 2001 | caldon
Moisture would be my main concern. Even though components are plastic, they can absorb moisture. Moisture is also detrimental to the the solder itself. The water droplets that are left behind (evaporated even) could cause problems (i.e. chlorides).
Electronics Forum | Fri Nov 02 08:30:40 EST 2001 | fmonette
For double-side reflow boards, take note that if you have moisture-sensitive components on the first side, you will need to track their remaining floor life up to the final reflow. This is because the reflow process is too fast to effectively remove
Electronics Forum | Mon May 13 10:37:56 EDT 2002 | fmonette
The other important issue relates to moisture sensitive devices (MSD). If you have MSDs on the first side, you need to track the remaining floor life of the components on the partially assembled boards between the first and second reflow. Contrary to
Electronics Forum | Mon Mar 08 14:39:54 EST 2004 | Gabriele
Have you considered those Tant Caps could be moisture Sensitive Components ? During last year, several Brand Suplliers classified their Tant Caps as Moisture Sensitive Level 2a (4 wks out of dry pack before reflow, see J-STD-033a) some even MSL:3
Electronics Forum | Wed Jul 20 15:18:35 EDT 2005 | FW
Hi! We have both Dip & Spray conformal coating processes & have never done any kind of baking before the process! I am assuming the reason for baking would be the same - ie, remove any moisture on the brds since moisture will create failure of the co
Electronics Forum | Tue Nov 08 20:58:49 EST 2005 | davef
We buy humidity as a potential cause of solder balls, but we're not biting on dewetting. Something else is causing that. Questions are: * What's the temperature and RH of your SMT production area? * What kind of paste are you using? [Some water was
Electronics Forum | Fri Nov 03 15:31:18 EST 2006 | Steve
Mika, It's not my company, I've used them in the past to re-ball some BGA's for me. They always do a moisture removal bake on moisture sensitve devices prior to ball attach, and then pack them in a vacuum sealed moisture barrier bag when they retu
Electronics Forum | Mon Nov 13 10:02:52 EST 2006 | pforister
Bill, We only allow 3 boards to be printed in front of the pick and place equipment. It is important to keep the abandon time to a minimum. You did not mention the paste that you use. Do you use no-clean or water soluble? Do you use lead free?
Electronics Forum | Mon Jan 04 21:03:22 EST 2010 | cman
1) I'm not familiar with the acronym CAF. Could you spell that one out for me? 2)Why do you feel they need to be baked? Are they in a high humidity enviornment? the only time we bake is when we are dealing with moisture sensitive components. Do you b
Electronics Forum | Wed Dec 08 09:53:23 EST 2010 | fönsi
Hello Because of the cold weather, we had some troubles with drying out of printed solder paste on the pcb's. The relative humidity in the air declined below of 20%. We have a process window of store the printed board for maximum 24 hours, but with
