Electronics Forum | Thu Jul 07 04:34:19 EDT 2005 | Lloyd
This problem exists at a very low level but happens on all our discrete components, all our products and in two plants. Between the PCB land and the component termination there is a barrier of flux residue, this actually lifts the component slightly
Electronics Forum | Wed Aug 10 20:30:49 EDT 2005 | slthomas
I've got a new board (actually a new panel...a 4 up, with one row rotated, where it was a 2 up panel with no rotation before) that runs fine on the IVc but not on the IIIc. I've used the same reference points for the image rotation (fiducials) on bot
Electronics Forum | Fri Aug 12 09:50:19 EDT 2005 | fctassembly
It is true that the SAC alloys are very aggressive to unprotected solder pots but the SN100C lead free alloy can be used in these pots IF they are not already being wetted by your SN63 alloy. FCT Assembly offers a program that includes free tin wash
Electronics Forum | Sun Aug 14 22:58:17 EDT 2005 | crishan
Hi All, I would like help in establishing what is a feasible PPM reject rate from a typical SMD line. As a reference an SMD line consists of, solder paste printer, chip component placement, pick and place IC components and reflow. What is a bench
Electronics Forum | Tue Sep 06 09:20:50 EDT 2005 | Bob R.
We approached it the same way we select SnPb pastes. We started by doing coupon level tests to sort out the obvious "bad" pastes: SIR, wetting, solder balling, print quality, etc. That cut the field in half. From there we started to do assembly l
Electronics Forum | Thu Sep 08 01:58:08 EDT 2005 | darby
0. Any less and you are scooping the paste from the aperture with the squeegee blades. I'm not saying that either of these situations is a good or a bad thing, it's just that if you buy a 6 mil stencil, you are trying to achieve 6 mil paste height.
Electronics Forum | Wed Sep 07 16:53:15 EDT 2005 | GS
Contact Cookson Electronic, they can support you with OSP solutions (ENTEK---) new formulations for Lead Free apllication. Regards GS --------- from a 2003 Cookson presentation: Objective Although Existing ENTEK� PLUS CU106A technology is suc
Electronics Forum | Thu Sep 08 06:19:55 EDT 2005 | lupo
Hello, Could anyone provide some support concern issue with vertical fill of through hole solder. Our lead free wave soldering process is not capable to fill 100% (requirement of our customer)through hole. We made everything (DoE) - different amoun
Electronics Forum | Wed Oct 26 10:40:43 EDT 2005 | patrickbruneel
Jimmy, We've been soldering tin plated components and Ni/Sn (100% Tin) boards with leaded solder in the 80's in hirel and military applications. We never experienced reliability issues with the mechanical or electrical properties of the solder joint
Electronics Forum | Fri Dec 16 03:47:46 EST 2005 | gpaelmo
Anyone have problems wave soldering white tin finish? We are an ems and our customer provides us the pcb's. SMT and TH components on the board. SMT is fine but when we wave solder, wetting to top side is very poor (solder only flows half way up). We
