Electronics Forum | Wed Aug 11 07:20:33 EDT 2004 | gregoryyork
HASL Fluids are generally not RA based fluxes. They are generally fluxes based on hydrochloric acid or hydrobromic acid or a mixture of the two, plus some very strong wetting agents that are very hygroscopic. Doesn't the residue of hydrochloric go wh
Electronics Forum | Tue Aug 10 06:29:49 EDT 2004 | Nippy
Hello, I am in need of some assistance with a problem we are having with soldering some terminals... Basicaly I need to solder thin tabs onto a round metal post (hole through tab) We have been seeing poor quality joints, de-wetting and what looks l
Electronics Forum | Tue Aug 24 21:52:06 EDT 2004 | rose
recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was reflowed u
Electronics Forum | Wed Aug 25 20:48:17 EDT 2004 | rose
Hello recently I met one very interesting issue with my board and connector. substrate of the board is copper with immersion silver, pad size is about 3x1mm. we print lead-free paste on the pad, then put the connector on the paste. The board was refl
Electronics Forum | Wed Sep 01 20:10:54 EDT 2004 | KEN
The alloy I have chosen uses a wetting angle of 50-70 degrees. Different alloys have different properties. I coupled experimental data with what others have published. Nothing new here. As for reliability...I think you'll be surprised what lead fr
Electronics Forum | Tue Sep 28 17:56:02 EDT 2004 | Vee Sar
Adam, I would first check hole to lead sizes on the components that you are having hole fill issues with to see that the spacing is withing spec. Second, check for oxides on lead tips, and contaminated leads that cause poor wetting and insufficient
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Thu Sep 23 16:23:08 EDT 2004 | russ
Pb free pastes do not wet out like 63/37. Their are no claims from any manufacturers that I am aware of that say it will. Your "little solder balls" are likely caused from oxidization during reflow. What type paste are you using 3,4,5? What are t
Electronics Forum | Thu Sep 23 23:42:52 EDT 2004 | KEN
The LF pastes will have virtually NO wetting spread. This is normal. LF mobilities are virtually non-existant with SAC alloys. However, the addition of varrying amounts of silver can (and does) improve mobility but, this comes with a price (paste
Electronics Forum | Mon Oct 25 21:19:06 EDT 2004 | davef
Q1: I thought we have a industry standard for this. A1: We're unaware of such a standard. IPC-7525 - Stencil Design Guidelines has a brief section on stencil inspection. We've talked about it previously on SMTnet. If you can't find it in the Archiv
