Electronics Forum | Tue Jan 14 12:20:33 EST 2020 | cyber_wolf
If you are using standard alloy and flux types and you are within the ballpark of 30-90 seconds above liquidous you should be fine. As I said above unless your profile is grossly off, it is not the cause of your voids.
Electronics Forum | Tue Oct 02 16:07:37 EDT 2012 | mmjm_1099
Have you come to a conculsion on this yet? If so please post for all to review.
Electronics Forum | Tue Oct 23 08:07:44 EDT 2012 | kkay
I have attached a PDF overview of some test we have done and the results. (fixed oven profile)
Electronics Forum | Thu Oct 25 11:25:56 EDT 2012 | aj
great report and good to see results
Electronics Forum | Thu Nov 01 10:52:06 EDT 2012 | kris1128
Hello kkay, can I ask what type of solder paste the #4 sample was? Thanks!
Electronics Forum | Tue Jan 07 17:33:26 EST 2020 | SMTA-Norah
Were the boards baked out before soldering? Is there plated over vias in the pads?
Electronics Forum | Wed Jan 08 10:04:29 EST 2020 | emeto
We don't have plated vias on these pads.
Electronics Forum | Fri Jan 10 14:37:02 EST 2020 | emeto
Zack, would you recommend longer TAL or higher peak temp or both together?
Electronics Forum | Tue Jan 14 13:28:44 EST 2020 | cyber_wolf
Your profile looks textbook.
