| https://www.eptac.com/ipc-medical-industries-technical-conference-lead-free-reliability-readiness/
: Reliability Priorities for Lead-Free Dr. Peter van der Heide, Sr. Director of Product Creation Process – Philips Healthcare 9:00 am Tin Whiskers: Detection, Formation, Mitigation Bob Landman, Technologist
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Continuing her graduate studies 2011 Pylin Sarobol , Purdue University (West Lafayette, IN) Paper: "Growth Mechanisms for the Formation of Tin Whiskers" Where is she now? R
| https://ipcapexexpo.org/education/call-for-participation
) Test Method Developments Tin Whiskers Enabling Future Technologies Microminiaturization Nanotechnology E-textiles and Smart Textiles Energy Harvesting Flexible Hybrid Electronics Graphene in Electronics Manufacturing LED Manufacturing Optoelectronics Photovoltaics Sensors and Haptics Wearables Meeting
| https://www.eptac.com/blog/ipc-medical-industries-technical-conference-lead-free-reliability-readiness
: Reliability Priorities for Lead-Free Dr. Peter van der Heide, Sr. Director of Product Creation Process – Philips Healthcare 9:00 am Tin Whiskers: Detection, Formation, Mitigation Bob Landman, Technologist
Surface Mount Technology Association (SMTA) | https://www.smta.org/store/book_store.cfm
properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects
| https://www.eptac.com/wp-content/uploads/2020/02/eptac_webinar_03-18-20.pdf
“What forces the users of 001 to have a tin mitigation plan?” – The point being “…if no whiskers were found on all the products since the introduction of lead- free, some questions still arise as to the need to have a plan and in some case the plan is to have no plan. 5 J-STD-001 GS/HS
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. Immersion tin (ISn) is a popular option for press-fit applications since it produces tight tolerances for holes and is RoHS-compliant. However, handling the PCB can cause tin whiskers and soldering problems. Due to
| https://www.eptac.com/category/upcoming-webinars/shown.bs.collapse/page/9/
. Director of Product Creation Process – Philips Healthcare 9:00 am Tin Whiskers: Detection, Formation, Mitigation Bob Landman, Technologist – H&L Instruments 9:45 am PERM (Pb-free Electronics Risks Management) Status Report Anthony
