Electronics Forum | Wed Feb 05 11:21:24 EST 2003 | pjc
First off, get them designed out. I had this problem once and filled them with SMD adhesive and cured prior to printing. We were careful to be sure the solder lands were clean of any adhesive prior to curing. It worked out very well and we did this p
Electronics Forum | Mon Feb 10 05:32:44 EST 2003 | matherat
BPan, I would like to discuss a possible solution to this that involves some of the suggestions found here but, with a twist that our process offers. This would be better discussed one on one somewhere other than this forum so if you still need sugg
Electronics Forum | Thu Feb 06 09:53:38 EST 2003 | genny
Actually, the most common reason I have seen vias in pads is for grounds in RF applications where the frequencies are high enough that you need a ground RIGHT THERE!... not .1" away. Vias and traces have RF properties of capacitance and inductance,
Electronics Forum | Fri Nov 15 15:02:37 EST 2002 | MA/NY DDave
OK I know it is funny to have two different PWB/PCB processes, one for pre production and one post production yet it is possible if controlled and implemented in a strategy. In debug if your company's experience has been for a repeated need to do IC
Electronics Forum | Wed Jul 23 03:04:57 EDT 2008 | gfro
Hello, We are using a PCB with thickness 3.2mm 4 layer and lot of through hole via's of diameter 0.4mm. We specified our PCB vendor to do plugging. Now we have big problems, that after 1..4 weeks we measure a low resistance between track's/via's of
Electronics Forum | Mon Sep 28 19:07:47 EDT 1998 | Steve Gregory
| I have had some field failures returned recently, the boards had flux contamination under the components in a sensitive area, Nothing really visible until the component was removed, and the board had no evidence of rework of any type. Is it poss
Electronics Forum | Wed Feb 05 13:08:20 EST 2003 | joeherz
You're correct that a thicker solder deposit will make bridging on fine pitch devices a bigger risk. Another alternative could be to slightly over-print the pads (onto the soldermask) ala pin-in-paste process. Basically adding enough solder to fill
Electronics Forum | Tue Sep 29 04:54:23 EDT 1998 | Clive Heke
Thank you Steve for your input it was very usefull. I think I skipped a few pertinant details on my initial message though, the component which we found the flux contamination on was on the top side of the board, I was curious if the flux could come
Electronics Forum | Thu Feb 06 14:47:50 EST 2003 | MA/NY DDave
Hi "some customers/designers want to have via holes to be present in the PCB pad, due to some belief that it helps in heat dissipation. " As I think about this I don't know exactly why they would be concerned. I can imagine in some exotic products
Electronics Forum | Mon Feb 10 21:30:48 EST 2003 | MA/NY DDave
Hi You are probably right. The only thing I will tell you is that one time as thee DFM engineer working between many electronic designers, component manufacturers and CEMs (contract electronic manufacturers) the component manufacturer would not bud
