Electronics Forum | Wed Aug 25 19:31:22 EDT 1999 | Dave F
| JUST WANDERING IF ANYONE IS PRINTING ADHESIVE ON THE BOTTOM SIDE OF BOARD WITH THROUGH HOLE COMPONENTS ALREADY PLACED. I'VE BEEN TOLD IT IS POSSIBLE BUT WANT TO LOOK INTO THIS PROCESS IN DEPTH. | Chad: You don't need to YELL!!! Anyhow, yes we ha
Electronics Forum | Mon Aug 29 13:43:58 EDT 2011 | jax
Enlarging the "End Pads" is normally done to help accomodate the Wave soldering process... works as solder thief to help eliminate bridging on the last 2 pins to cross the wave. It is reasonable to assume that, if you are seeing cold solder due to fl
Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake
The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil
Electronics Forum | Wed Oct 20 07:09:12 EDT 2004 | mattkehoe
Not really. Our process is a solid solder deposition application so we are not placing components into the wet paste prior to reflow. We print the paste then reflow is without components, trying to create a meniscus which is then washed, flattened,
Electronics Forum | Sat Feb 08 04:37:19 EST 2020 | spoiltforchoice
I work with small batches and this is what I do. However I don't do it because of the paste. Instead I do it because I am the sole operator on the line and I want one process finished so I can keep a better eye on the others. I specifically work with
Electronics Forum | Fri Nov 19 22:18:03 EST 1999 | mark
Laser cut offers the following two major advantages... the aperture tolerance is much better and the trapezoidal apertures are more consistant. For the small difference in price, you get the assurance of
Electronics Forum | Wed Feb 07 09:37:48 EST 2007 | billyd
Had the very same thing happen the first time we used the small QFNs. The aperture for the thermal pad in the center needs to be cut in a grid form, either squares (with around a 10 mil spacing between openings) or circles, like a BGA pattern. Too mu
Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake
Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point
Electronics Forum | Tue Jul 09 08:29:10 EDT 2002 | r_sturdevant
I agree with others here who have questioned the amount of solder and reliability of the joint when using this aperture shape. I have had experience with these with MELFS, and the main issue I've seen comes when cleaning the stencil - all those littl
Electronics Forum | Mon Feb 19 12:43:16 EST 2001 | billschreiber
I�m going to reference Mr. Clouthier�s article again. It seems that the information contained within his article is answering many of the questions that are being asked. I highly recommend that everyone reads it. A copy can be found at the followi
