Industry News | 2011-11-11 14:38:51.0
Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
Industry News | 2012-05-30 18:23:07.0
IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Industry News | 2011-04-20 21:26:17.0
IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.
Industry News | 2014-03-28 09:54:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.
Industry News | 2011-05-12 22:13:47.0
Nordson DAGE showcased its newly developed 4000Plus pad cratering inspection system at Nepcon Shanghai.
Industry News | 2011-10-03 17:04:22.0
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.
Industry News | 2011-09-06 15:27:12.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) will highlight its 4000Plus multi-purpose bondtester in Booth F05 within the Singapore Pavillion at NEPCON Vietnam
Industry News | 2011-11-20 13:14:27.0
Nordson DAGE has been awarded a Global Technology Award in the category of Test Equipment for its 4000Plus Bondtester Pad Cratering Inspection System.
