Electronics Forum: inspection techniques (Page 2 of 8)

Re: Dicing Operation

Electronics Forum | Wed Oct 28 19:45:33 EST 1998 | Ron Gilman

I will try to answer some of your questions. My name is Ron Gilman and I am President of Chipscale Robotics here in Fremont California. We manufacture Die Pick & Place equipment and would be happy to send you brochures. Please email me with your a

BGA Solderability Standard

Electronics Forum | Tue Sep 07 15:11:35 EDT 2004 | Dreamsniper

It's been a while since BGA usage become widespread. Ton's of articles had been written with regards to design, processing, techniques, inspection etc...but it seems like there's still no hard ground for standards and IPC 7095 doesn't cover everythin

Re: First Article

Electronics Forum | Wed Oct 06 15:29:24 EDT 1999 | Tony

| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other

First Article Inspection, Lower End AOI

Electronics Forum | Wed May 25 15:10:21 EDT 2011 | brockltd

As the Americas distributor, there's a chance that I'm severly biased here but even with that, you should check out the Cluso Vision System for FAI. I've worked with many AOI platforms over the years, back even when each machine shipped with it's own

Flux dip or solder print for CSP

Electronics Forum | Mon Feb 13 01:47:28 EST 2017 | soldertraining

Solder flux and solder paste deposition is a standard step during the chip attach and sphere attach portions of BGA and CSP assembly. A technique called ultra-violet fluorescence intensity mapping (UV FIM) has been introduced that allows flux measure

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Gil

Electronics Forum | Mon Jun 18 15:42:32 EDT 2001 | Gil Zweig

Transmission x-ray inspection is the technique most people are familiar with. Since materials will absorb or transmit x-rays as a function of their atomic number and thickness, the transmission x-ray image provides a two dimensional represenation of

Why AOI. Features one should look while considering AOI

Electronics Forum | Sat Aug 07 01:04:40 EDT 2004 | rsgupta

Why not.. You are always welcome. Firstly what I feel multicamera system (Top and Angled) AOI is always better than single Top camera system in terms of defect coverage. Secondly read On the fly inspection is much better than STOP and Go techniques.


inspection techniques searches for Companies, Equipment, Machines, Suppliers & Information

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