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Additive Manufacturing for Next Generation Microwave Electronics and Antennas

Technical Library | 2020-08-13 00:59:03.0

The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime. The nature of additive manufacturing allows designers to create custom components and devices for specialized applications and provides an excellent and inexpensive way of prototyping electronic designs. The combination of multiple printable materials enables the vertical integration of conductive, dielectric, and semi-conductive materials which are the fundamental components of passive and active circuit elements such as inductors, capacitors, diodes, and transistors. Also, the on-demand manner of printing can eliminate the use of subtractive fabrication processes, which are necessary for conventional microfabrication processes such as photolithography, and drastically reduce the cost and material waste of fabrication.

Georgia Institute of Technology

Additively Manufactured mm-Wave Multichip Modules With Fully Printed "Smart" Encapsulation Structures

Technical Library | 2022-02-09 17:52:47.0

This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process.

Georgia Institute of Technology

Printable Electronics: Towards Materials Development And Device Fabrication

Technical Library | 2023-03-13 19:06:53.0

Purpose – There has been increasing interest in the development of printable electronics to meet the growing demand for low-cost, large-area, miniaturized, flexible and lightweight devices. The purpose of this paper is to discuss the electronic application of novel printable materials. Design/methodology/approach – The paper addresses the utilization of polymer nanocomposites as it relates to printable and flexible technology for electronic packaging. Printable technology such as screen-printing, ink-jet printing, and microcontact printing provides a fully additive, non-contacting deposition method that is suitable for flexible production.

i3 Electronics

Heraeus Printed Electronics and SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing with Inkjet Technology

Industry News | 2024-03-11 14:54:34.0

Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.

Heraeus

How to Manufacture Printed Electronics - Live Print Demonstration

Industry News | 2012-11-20 17:30:48.0

On Dec 5-6, the Printed Electronics USA conference and exhibition in Santa Clara, CA, will feature "Manufacturing Street" - its first live, multi-technology, printed electronics demonstration. Being part of the exhibition, Manufacturing Street brings together organizations in the supply chain who will demonstrate a number of printing and process steps in interactive sessions throughout the event, printing functional inks.

IDTechEx, Inc.

IDTechEx Printed Electronics Europe 2013 Award Winners

Industry News | 2013-04-18 22:09:16.0

The annual printed electronics award winners were announced at the IDTechEx Printed Electronics event this week in Berlin, Germany. The awards recognize outstanding progress in the development and commercialization of printed electronics, an industry that produces a huge amount of technical innovation which will be used in many products, and is now being widely adopted.

IDTechEx, Inc.

Analog Output  AO650 ABB

Analog Output AO650 ABB

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1  Mobile(Whatsapp): (+86)-18020776786 ​​​ Yuehang:  Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply: New+original+factory sealed+high quality

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

ABB CI615K01 3BSE000756R1

ABB CI615K01 3BSE000756R1

New Equipment | Industrial Automation

Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services  Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

ABB CI615K01 3BSE000756R1

ABB CI615K01 3BSE000756R1

New Equipment | Industrial Automation

Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services  Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

ABB CI630 3BSE011000R1

ABB CI630 3BSE011000R1

New Equipment | Industrial Automation

Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services  Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.


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