Industry News | 2018-04-16 20:18:35.0
SMTA Europe announces Session 5 Technical Program on Adhesives and Coatings at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Industry News | 2020-02-18 15:10:01.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
Industry News | 2013-05-01 12:45:51.0
Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht
Association Connecting Electronics Industries (IPC)
Industry News | 2015-05-21 22:04:20.0
Nordson ASYMTEK announces that registration for its 2015 Technology Days is now open. The event will focus on how innovation and continuous technological developments in fluid dispensing, jetting, and conformal coating improve the way companies bring their products to market. Technology Days is being held in Maastricht, The Netherlands on June 17 and 18, 2015.
Industry News | 2003-05-06 08:21:44.0
Will address key issues in the
Industry News | 2010-12-17 21:02:56.0
The SMTA is pleased to announce the Best Papers from SMTA International 2010. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, and the Best International Paper.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
